发明名称 CIRCUIT SUBSTRATE DEVICE
摘要 PURPOSE:To facilitate the work of connecting input and output patterns to a terminal by soldering a flexible conductor line formed through a process of peeling from a substrate one part of a thick film conductor pattern formed on the surface of a ceramic substrate to a terminal which penetrates the substrate. CONSTITUTION:A thick film conductor pattern 15 is formed by drawing of a thick film conductor pattern 15A serving as an input and output line formed on the surface of ceramics substrate 1, and a resin film 16 of desired shape is stuck to the surface of the thick film conductor pattern 15 and then the thick film conductor pattern 15 is peeled off from the ceramics substrate 1. A flexible conductor line 20 is curved upward above the ceramics substrate 1 and a hole 19 provided at the end portion of the curved portion is fitted over the end portion of the terminal 2 and the flexible conductor line 20 is soldered to the end of the terminal 2. Hence soldering is needed at only one positive where the terminal 2 is joined to the flexible conductor 20 and so connecting work is facilitated to that extent.
申请公布号 JPH03133071(A) 申请公布日期 1991.06.06
申请号 JP19890269398 申请日期 1989.10.17
申请人 FUJITSU LTD 发明人 TSUJIMURA YUKO;TAKADA TOSHIAKI;KUTOKU TERUYOSHI
分类号 H01R9/16;H05K1/09;H05K3/32;H05K3/40;H05K7/14 主分类号 H01R9/16
代理机构 代理人
主权项
地址