Layer circuits with substrate of aluminium oxide or nitride ceramic - are bonded to base of metal, ceramic or plastic using UV-hardenable adhesive

摘要

Layer circuits with substrate of Al oxide or Al nitride ceramic up to 1500 microns thick are secured to base of metal, ceramic, or plastics by (1) applying on the base and/or reverse side of the ceramic substrate a UV-hardenable adhesive resin (I) (2) positioning circuit and substrate on the base and (3) irradiating circuit and front face of substrate with UV whereby (I) is hardened through portion of UV penetrating the substrate. Substrate is less than 1100, partic less than 700, microns thick. (I) is hardened radically or cationically, partic cationically hardenable epoxide resin or radically hardenable (meth)acrylate-functional resin. (I) also contains heat-conductive filler and/or thixotropic agent and/or additive for improving wetting and/or adhesion. UV with output density more than 50, partic more than 100, mW/sq cm is used. USE/ADVANTAGE - Mounting circuits on base for improved handling, protection from mechanical damage in subsequent operations, and conducting away heat. (I) is solvent-free, one component system with practically unlimited pot life; (I) can be hardened rapidly so allowing incorporation in continuous prodn processes; (I) can be hardened at low temp, avoiding undesired flow through action of heat; hardened (I) has high thermal stability, heat conductivity, and elasticity.