| 摘要 |
A semiconductor device includes a lead frame having a tab (1) and outer leads (4) arranged at both sides of the tab, and a semiconductor chip (3) having electrode pads (5) at a pheriphery thereof. The semiconductor chip (3) is adhered through an insulating adhesive to the tab (1) integrally formed of an outer lead (4'). Therefore, since the tab (1) is used as one of wiring layers in the semiconductor device, it is possible to apply an electric potential different from that of the tab to the semiconductor chip. |
