Curable epoxy resin compositions.

摘要

Disclosed are curable epoxy resin molding compositions comprising (a) an epoxy resin, optionally a phenolic resin, and (c) a silicone-modified resin selected from a reaction product of an epoxy resin with an amino-modified polysiloxane having an amino group at only one end of its chain or a reaction product of a phenolic resin with an epoxy-modified polysiloxane having an epoxy group at only one end of its chain. The molding compositions retain good moldability while showing excellent mechanical strength and low internal stress.