| 摘要 |
PURPOSE:To provide the subject composition composed of a specific epoxy (meth)acrylate resin modified with a polybasic acid and a polymerizable monomer and capable of giving a laminated board having excellent electrical characteristics, low-temperature punchability, heat-resistance and chemical resistance. CONSTITUTION:The objective resin is produced by compounding (A) a polybasic acid-modified epoxy (meth)acrylate resin produced by reacting an epoxy resin (preferably bisphenol A epoxy resin) free from halogen in the molecule with a >=4C polybasic acid (preferably a dimer acid) and then reacting with (meth) acrylic acid. (B) a polymerizable monomer having unsaturated bond copolymerizable with the component A (preferably styrene) and preferably further (C) a resin having an unsaturated bond copolymerizable with the component B. The amounts of the components A, B and C are preferably 68-3wt.%, 15-85wt.% and 3-68wt.%, respectively. |
