Resin-sealed semiconductor device

摘要

The semiconductor device comprises a semiconductor element 4, a lead 8, and a wire 7 electrically connecting the semiconductor element and the lead. The semiconductor element, the wire, and a portion of the lead are sealed in resin 9. Corrosion inhibitor selected from the group consisting of lead oxide, calcium hydroxide and zinc oxide is added into the sealing resin. Corrosion of the copper wire is supressed even in high temperature environments.