发明名称 LIGHT WEIGHT HEAT-INSULATING RESIN COMPOSITION
摘要 PURPOSE:To obtain the subject composition of light weight excellent in heat control and having an applicability, e.g. to a space machine as a typical example for application thereof by blending a phenolic resin with micro balloons composed of silica and a specified amount of an epoxy-amine-based resin. CONSTITUTION:(A) A phenolic resin (e.g. phenol-formaldehyde resin, etc., preferably having 120mum maximum diameter, 5mum minimum diameter, 35-48mum average particle diameter, 0.10-0.15g/cm<3> bulk density and 0.21-0.35g/cm<3> true density) and micro balloons composed of silica are blended with (B) an epoxy-amine- based resin composed of an epoxy resin consisting of a straight chain polymer such as a polyalkylene glycol having one or more terminal glycidyl groups and an amine-based resin such as an aliphatic amine, an alicyclic amine or an aromatic amine preferably in a weight ratio of (4:6)-(6:4) to obtain the objective composition.
申请公布号 JPH03131621(A) 申请公布日期 1991.06.05
申请号 JP19890268027 申请日期 1989.10.17
申请人 NATL SPACE DEV AGENCY JAPAN<NASDA>;KAWASAKI HEAVY IND LTD;YOKOHAMA RUBBER CO LTD:THE 发明人 FUKUSHIMA YUKIO;NAKAMURA TOMIHISA;FUJITA TAKESHI;SAKAI YOSHINORI;MOTOYAMA CHIKASHI;SOMEYA YOSHIAKI;FUJIWARA ISAMU;YAMAZAKI HAJIME
分类号 C08K7/22;C08G59/00;C08G59/20;C08G59/50;C08K7/26;C08L63/00;C09D163/00 主分类号 C08K7/22
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