Photosensitive resin composition and semiconductor apparatus using it.

摘要

The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: <CHEM> wherein 0.5-50 mol% of R1 consists of a silicone diamine residue represented by the following formula [II]: <CHEM> wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol% of R1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.