| 摘要 |
A laminated electronic component such as a laminated ceramic capacitor, multilayer circuit board, laminated type LC filter, L chip or C network is manufactured by preparing a ceramic sheet (1) provided with orientation marks (3) punching the ceramic sheet (1) on the basis of the positions of the orientation marks (3), and stacking such ceramic sheets (1) on the basis of the positions of the orientation marks (3). The punching step and the stacking step, which require alignment, are carried out on the basis of the positions of the orientation marks, whereby the ceramic sheets are stacked in high accuracy of alignment in the laminated electronic component as obtained. <IMAGE> |
