发明名称 Laminate for electroless metallization, a printed circuit provided with same, and a process for the manufacture of such a laminate.
摘要 <p>Laminate for electroless metallization comprising a substrate and one or more layers of a polyamine polymer of which at least the first layer is a crosslinked polymer. Metallized products comprising said laminate exhibit an improved metal peel strength. The preparation of a laminate of the above type involves a modification step in which the polyamine polymer is crosslinked. Additionally, the modification step serves to tailor the complexing activity of the substrate. The preferred polyamine polymer is polyethylene imine, which preferably is modified using glutaraldehyde.</p>
申请公布号 EP0430333(A1) 申请公布日期 1991.06.05
申请号 EP19900203029 申请日期 1990.11.15
申请人 AKZO N.V. 发明人 SCHUTYSER, JAN ANDRE JOZEF
分类号 H05K1/03;C08G73/02;C23C18/20;H05K3/18;H05K3/38;H05K3/42;H05K3/46 主分类号 H05K1/03
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