Inner lead bonding inspecting method and inspection apparatus therefor.

摘要

An inner lead bonding inspecting method comprises the steps of: irradiating an illumination light onto the planar surface of a bonding portion between an electrode bump provided on a semiconductor pellet and an inner lead, measuring a quantity of a reflected light from the surface, and judging whether the bonding state of the inner lead bonding is good or bad on the basis of the measured result. According to anotehr aspect, an inner lead bonding inspecting apparatus comprises irradiation device (12) for irradiating a light onto a planar surface of a bonding portion between an electrode bump provided on a semiconductor pellet and an inner lead; light quantity measurement device (13) for measuring a quantity of a reflected light from the inner lead surface, and judgement device (15) for comparing the measured quantity of reflected light with a reference light quantity to judge bonding state.