发明名称 |
Semiconductor integrated circuit apparatus |
摘要 |
A semiconductor integrated circuit device including first and second transmission leads formed on both sides of a resin film on which a semiconductor integrated circuit chip is mounted. These leads are connected at portions immediately close to the high-speed input terminals of the chip by through-hole leads. This chip-to-lead configuration according to the present invention is significantly effective for a GaAs logic integrated circuit or the like that processes high-speed input signals.
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申请公布号 |
US5021866(A) |
申请公布日期 |
1991.06.04 |
申请号 |
US19880250183 |
申请日期 |
1988.09.28 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUDO, TOSHIO;SAITO, KAZUTAKA;TAKUBO, CHIAKI |
分类号 |
H01L21/60;H01L23/538 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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