发明名称 MIRROR SURFACE ABRASION LIQUID OF CDTE WAFER AND MIRROR SURFACE ABRASION
摘要 PURPOSE:To enable a CdTe wafer to be finished to a mirror surface with a small undulation by including such constituents as aqueous solution of hydrogen peroxide water, sodium bicarbonate, sodium carbonate and by setting pH to a specific range. CONSTITUTION:Mirror abrasion is performed by applying a wafer to an adhesion plate with an adhesive such as wax and by pressing a specific load to a rotary surface plate which can rotate freely where an abrasion cloth is applied to an by rotating the rotary surface plate. An abrasion liquid is dropped onto the surface of the abrasion cloth and the abrasion liquid forms an abrasion liquid layer between a CdTe wafer and the abrasion cloth. An aqueous solution of hydrogen peroxide water, sodium bicarbonate, and sodium carbonate is used as a mirror-surface abrasion liquid. This system of abrasion liquid takes a wide pH value from a weak acid to a strong base with pH ranging from 8 to 10. The surface undulation is large at the weak acid to neutral region (pH: approximately 7). Also, decomposition of hydrogen peroxide water is fast within the abrasion liquid at the strong base region (pH: exceeding 10) and it is not suitable for use as the abrasion liquid).
申请公布号 JPH03131025(A) 申请公布日期 1991.06.04
申请号 JP19890268244 申请日期 1989.10.17
申请人 NIPPON MINING CO LTD 发明人 KIHEIDA YUKINORI;MARUYAMA NOBUTOSHI
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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