发明名称 |
Burn-in apparatus |
摘要 |
A burn-in apparatus includes burn-in boards for holding semiconductor devices through air suction and for electrically connecting them to external equipment. Since the semiconductor devices are held on the burn-in boards for electrical connection through air suction, sockets are not necessary to hold them on the boards which reduces costs. Further, the leads of semiconductor devices, which have conventionally been susceptible to bending when inserted into or extracted from the sockets, can be protected.
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申请公布号 |
US5021733(A) |
申请公布日期 |
1991.06.04 |
申请号 |
US19900463544 |
申请日期 |
1990.01.11 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
EBIHARA, SACHIKO;FUKUSHIMA, YASUHIKO |
分类号 |
G01R31/26;G01R31/28;G01R31/30;H01H19/44 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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