| 摘要 |
<p>PURPOSE:To reduce the damage on an element and dusting by arranging wafer guide sections at upper and lower two stages of the half pitches of groove pitches and the wafer holding section of the groove pitches of wafer pitches to the intermediate sections of the upper and lower stage wafer guides, opening and closing the wafer holding section in the intermediate section and guiding and sustaining wafers. CONSTITUTION:A first wafer group 1 is guided and lifted by groove sections superposed to the flat end section of an intermediate-stage chuck 5 in the grooves of upper and lower stage chucks 3, 4 under the state in which the end face of the intermediate-stage chuck 5 is opened from the groove bottoms of the upper and lower stage chucks 3, 4. When the end face of the intermediate stage chuck 5 is arranged with the end faces of the upper and lower stage chucks 3, 4, the first wafer group 1 is held by the flat end section of the intermediate-stage chuck 5, and all upper, intermediate and lower stage chucks 3, 4, 5 are conformed in grooves, pitches of which are displaced by half. When the next wafer group 2 is guided and elevated by the coinciding groove sections and the state in which the end face of the intermediate-stage chuck 5 is closed from the end faces of the upper and lower stage chucks 3, 4 is brought, both the first wafer group 1 and the next wafer group 2 are sustained, and the composition of wafers at half pitches is completed.</p> |
