发明名称 |
Semiconductor cooling device |
摘要 |
A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.
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申请公布号 |
US5021924(A) |
申请公布日期 |
1991.06.04 |
申请号 |
US19890407159 |
申请日期 |
1989.09.14 |
申请人 |
HITACHI, LTD. |
发明人 |
KIEDA, SHIGEKAZU;NAKAJIMA, TADAKATSU;KUWAHARA, HEIKICHI;SATO, MOTOHIRO |
分类号 |
H01L23/44;H01L23/433;H01L23/473 |
主分类号 |
H01L23/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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