| 摘要 |
PURPOSE:To prevent the failure of mounting by a method wherein the position and amount of a dripped resin are detected by an image processing and the correction of the position and amount is automatically performed. CONSTITUTION:In a device for bonding a semiconductor element to a case 8 using a resin, the device is provided with a control part, which controls the discharge pressure, the discharge time and the like of a resin from a dispenser nozzle 3 for dripping the resin on a lead frame or the case and is used for a dispenser 4. Moreover, the device has a dispenser driving unit 6 for driving the nozzle 3, a drive control part 5 for controlling the unit 6, a camera 2 for recognizing the position, amount and form of the dripped resin and an image processing part 1 and is constituted in such a way as to perform the correction of the dripped position, discharge pressure and discharge time of the resin. Thereby, the failure of mounting can be eliminated.
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