| 摘要 |
PURPOSE:To make it possible to remove easily a defective among dies by a method wherein when a die is heated for a long time, a perforation is performed in the frame part, which is located near the heated die, of a hoop-shaped lead frame. CONSTITUTION:In a wire bonder, by which a hoop-shaped lead frame 3 subjected to die bonding is transferred and a wire bonding is performed, the bonder is provided with a timer 5 for regulating the dwell time of each die 8, which is located at a wire bonding position and is located on a heater 1, and a punch 9 for putting a hole mark 10 on a flame part 12 near a heated die 8 in case the dwell time of the die exceeds a regulated time. Thereby, a defective die 11 can be easily removed and the reliability of a manufactured semiconductor device can be improved. |
