| 摘要 |
<p>PURPOSE:To surely keep the tip of a lead flat in a vertical direction and to improve it in solderability by a method wherein outer leads are interlinked together with a thin tape of low melting alloy which contains tin or lead. CONSTITUTION:A thin tape of low melting alloy containing tin or lead is soldered to the upsides of the flat tips of outer leads 2 of a semiconductor device 1. When the semiconductor device 1 is made to pass through a solder reflow oven to be mounted on a printed board by a soldering, the solder thin tape 3 is fused with the solder plating of the leads 2 and the solder paste of the printed board and drawn onto the leads 2 by the surface tension of molten solder. By this setup, the tips of the leads 2 can be surely kept flat in a vertical direction and excellent in solderability.</p> |
