发明名称 CHUCK FOR TRANSFERRING WAFER-CARRIER
摘要 <p>PURPOSE:To sharply increase a degree of freedom at a transfer operation of a wafer carrier and to prevent a wafer and the like from being damaged by a method wherein the wafer carrier is held by means of a cantilever system and a side part of the wafer carrier is supported by using a support member. CONSTITUTION:When an air cylinder 7 is driven, respective right chuck pieces, 1a, 1'a and left chuck pieces 1b, 1'b are moved via an interconnection laver 6 so as to narrow a facing interval. As a result, chucks 1, 1' for transfer use sandwich respective wafer carriers 2, 2'. At this time, one-side edge parts 2a, 2'a of the wafer carriers 2, 2' are coupled at the inside of grooves 31a, 31'a, 31b, 31'b. In addition, support members 8, 8' come into contact with one-side parts of the wafer carriers 2, 2'. At a transfer operation, the wafer carriers 2, 2' are held by the chucks 1, 1' for transfer use in a state that the support members 8, 8' come into contact with their side parts; as a result, the wafer carriers 2, 2' are transferred without being shaken. It is possible to prevent a wafer 25 and the like from being damaged when they are transferred.</p>
申请公布号 JPH03129750(A) 申请公布日期 1991.06.03
申请号 JP19880256652 申请日期 1988.10.12
申请人 TOKYO EREKUTORON YAMANASHI KK 发明人 OSADA ATSUSHI
分类号 H01L21/677;B25J15/08;B65G49/07;B65H5/14;H01L21/68 主分类号 H01L21/677
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