| 摘要 |
<p>PURPOSE:To make it possible to obtain an accurate temperature at the time of a bonding by a method wherein a pad for resistance value detection use, which is connected to a bonding pad through a poly-silicon resistor, is provided and the resistance value of the resistor is measured. CONSTITUTION:A polysilicon resistor 9 containing phosphorus or boron is formed on a first insulating film 2 on a semiconductor substrate 1 and both surfaces of the resistor 9 and the film 2 are protected with a second insulating film 3. Moreover, contact holes 4 for connecting a bonding pad 10 and a pad 11 for resistance value detection use with the resistor 9 are respectively provided in parts, which are located on both ends of the resistor 9, of the film 3. At the time of a wire bonding, a metal wire 6 to make the pad 10 connect with a lead frame 5 is made to connect to the pad 10, a probe 7 is broght into contact to the pad 11 and the resistance value of the resistor 9 is obtained by the fine metal wire 6 and the probe 7. Thereby, a temperature at the time of a wire bonding can be accurately obtained from the relative relation between the temperature and the resistance value.</p> |
