发明名称 BONDING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to obtain a sufficient bondability by a method wherein a bonding device is constituted into such a structure that a press part for fixing a lead frame is not only slid in the vertically directions but can be moved in the transfer direction of the lead frame as well according to the amount of the shift of the transferred lead frame from the transfer direction. CONSTITUTION:A press part 1 is fixed on a press part mounting axis 2, is move up and down by the operation of a vertically driving cylinder 4 and a bearing part 3 supporting the axis 2 can be moved to the lateral direction along a transfer direction sliding axis 5 by the rotation of a ball screw 6 for bearing drive use. The rotation of is motor 10 for drive use is transmitted to the ball screw 6 through a pulley 8 for driving motor use, a belt 9 for transmission use and a pulley 7 for ball screw use. By this structure, the press part 1 can be moved to the transfer direction of a lead frame. Thereby, the press part 1 can be moved by the amount of the shift of transfer of the lead frame from the transfer direction to a bonding part and a sufficient bondability can be obtained.
申请公布号 JPH03129842(A) 申请公布日期 1991.06.03
申请号 JP19890269608 申请日期 1989.10.16
申请人 NEC KYUSHU LTD 发明人 OKAMURA TETSUO
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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