发明名称 HOT PRESS
摘要 PURPOSE:To obtain multilayered substrates which are free from voids and have good finishing accuracy by bringing the bottom end part of a cylindrical body, which moves upward/downward along the flank of an upper bolster of the hot press, into contact with the front surface of a lower bolster to enclose the multilayered substrates and hermetically sealing the cylindrical body, then dicharging the atm. air therein and supplying the gas having a prescribed pressure thereto. CONSTITUTION:The cylindrical body 23 is lowered by a lifting means 24 when the operation to insert the blank material of the multilayered substrates between respective hot plates 13 is completed. A hermetic space 23' is then formed in the cylindrical body 23 by an upper hermetically sealing means 25 and a lower hermetically sealing means 26 in the lowering position. A reduced pressure state is maintained in the hermetic space 23' by a discharge means 27 and the perheating and prepressurizing by a hot plate 13 are executed to remove the volatile components incorporated in an adhesive resin. The blank material of the multilayered substrates receives external force from the flank by the heating and the gas pressurizing when the heating and pressurizing by the hot plate 13 and the gas pressurizing by a gas supplying means are simultaneously executed. The generation of the wasteful flow of the resin and burring is obviated.
申请公布号 JPH03128195(A) 申请公布日期 1991.05.31
申请号 JP19890263017 申请日期 1989.10.11
申请人 HITACHI LTD;HITACHI TECHNO ENG CO LTD 发明人 MIYASHITA AKEMI;FUJII MUTSUMASA;KUBOSAWA MINORU;TORII KEIICHIRO;OKI NOBUAKI;FURUKAWA KIYONORI;KAWAGUCHI MASAMI;MUROOKA HIDEYASU;KYOI MASAYUKI
分类号 B30B7/02;B29C33/04;B29C43/20;B29C43/32;B29C43/56;B29C65/52;B29C65/78;B29L9/00;B30B12/00;B30B15/00;B30B15/34;H05K3/46 主分类号 B30B7/02
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