| 摘要 |
PURPOSE:To eliminate the restriction on high degree integration of an integrated circuit device caused by a testing probe, by a method wherein thin flexible conductors corresponding in number to connection terminals are radially arranged and supported by a flexible insulating film, and protruding metal electrodes as the contacts are arranged in the tip parts inside the radial arrangement. CONSTITUTION:Flexible conductors 40 are supported by a flexible insulating film 50, which is releasably supported by a probe main body 31 in an elastic manner. A testing probe 30 is pressed against a chip 10 with suitable pressure and protruding electrodes 41 are brought into contact with connection terminals 11. Even in the case where considerable irregularity exists in the heights of the connection terminals 11, the flexible conductors 40 supported by the flexible insulating film 50 bend so as to correspond to the irregularity, and the protruding electrodes 41 at the tip parts of the conductors 40 come into contact with corresponding connection terminals 11 with uniform contact pressure. Thereby the restriction on miniaturization and high degree integration of a chip 10 caused by testing is removed, and the economical properties of an integrated circuit can be improved. |
