| 摘要 |
PURPOSE:To improve the reliability of a small-sized semiconductor device provided with many pins, by installing a second bonding tool to be adjacent to a first bonding tool, and making the width of a contact bonding part of the second bonding tool larger than that of the first bonding tool. CONSTITUTION:A first bonding tool 10 performs first bonding by connecting a bonding pad formed on a semiconductor chip 1 and a lead part 2 of a package by using a bonding wire 4a. A second bonding tool 11 for performing second bonding is installed so as to be adjacent to the first bonding tool 10. The width W2 of a contact bonding part 12a of the second bonding tool 11 is made larger than the width W1 of a contact bonding part 13a of the first bonding tool 10. Hence the area wherein the bonding wire 4a is contact-bonded to the lead part 2 by the second bonding tool 11 is larger than the area wherein the bonding is performed by the first bonding tool 10. As a result, ultrasonic wave is easily applied, and the bonding strength is increased. Thereby the reliability of a small-sized semiconductor device provided with many pins can be improved. |
