| 摘要 |
PURPOSE:To manufacture a polyimide-resin laminated board, in which there is no warpage, by a method wherein long-sized metallic foils are superposed on the top face and underside of a required number of long-sized triaryl isocyanurate modified polyimide resin-impregnated dried base materials, passed between laminating rolls, cured, cut in necessary size, heated at a thermal deformation temperature or higher and cooled at the thermal deformation temperature or lower. CONSTITUTION:A long-sized beltlike laminate 4 in which the adhesives of copper foils 2 with adhesives are opposed and superposed to long-sized resin-impregnated dried base materials 1 on the top face and underside of the four resin-impregnated base materials in which a triaryl isocyanurate modified polyimide resin composed of 100 pt. triaryl isocyanurate, 0.1 pt. 2-ethyl-4-methylimidazole, and 130 pt. dimethylformamide is dried to a 100 pt. polyimide resin long-sized glass cloth is impregnated with the polyimide resin so that the quantity of the resin is brought to 45% and the polyimide resin is dried, and the laminated long-sized glass cloth and resin-impregnated base materials are passed between vertically disposed laminating rolls 3 and laminated is forwarded to 1 curing oven 5, and heated and cured at contact pressure at 260 deg.C. Said cured material is cut by a cutter 6, heated at 250 deg.C by a heating oven 7, and quenched at 60 deg.C by a cooling oven 8, thus acquiring a laminate, in which warpage is hardly generated. |
