PACKAGE FOR INTEGRATED CIRCUIT

摘要

A PLCC (Plastic Leaded Chip Carrier) (11) for LSI having protuberances (17) along its lateral side is provided with interconnectors (19) between leg portions of adjacent protuberances. Each interconnector swells from the bottom surface of the main body of the PLCC into the gap between the protuberances, but the height of the filling, namely the height of the interconnector, is lower than that of the protuberance to leave some space. This space, a channel (18), serves as a duct for solvent to flow smoothly to and from the narrow gap (25) between the soldered lead (12) and the top of the protuberance and is located adjoining this narrow gap so as to remove flux undesirably remaining in this narrow gap. The leg portion of the protuberance is strengthened by the interconnector so that the tendency of the protuberance to crack on the ejection of the molded PLCC from the molding cavity is considerably reduced. The corners between the top of the interconnectors and the adjacent leg portions of the protuberances may be rounded.