| 摘要 |
PURPOSE: To provide a structure which is mechanically stable and strong by a method, wherein a multilayer earthing plane surfaced assembly, which is bonded to a lead frame, is contained and the die of an integrated circuit is bonded to a composite assembly. CONSTITUTION: A grounding plane-surfaced assembly 10 is assembled as a unit before it is bonded to a lead frame. The copper protruding planar-surface 20 of the assembly 10 is bonded to an electrically insulating film 30 using a bonding agent 24, which can resist the high temperature of 300 deg.C such as a high-temperature epoxy bonding agent. Using a second layer 34 which can resist the same high temperature, a b-stage epoxy layer 40 is bonded to the surface on the opposite side of the insulating film 30. The copper grounding planar surface 20 contains copper foil or a sheet stock which change to about 1.5 to 20 mills in thickness. |
