发明名称 RESIN MOLDING DEVICE
摘要 PURPOSE:To provide the above device so that an uncured part is not generated on a formed product by curing even a resin material at a position directly below a pressing member, by a method wherein a matter having the quality of the material transmitting an electromagnetic wave to be applied to the resin material to cure the same is used as the pressing member. CONSTITUTION:A mold 1 having a mold surface 2 forming unevenness is provided, a UV(ultraviolet) curing resin material 3 is put on the mold surface 2, which is pressurized by putting a base plate 4 upon the same. A matter which is in a planar form identical with the mold surface and possesses a quality transmitting UV rays like transparent glass or a transparent synthetic resin plate is used for the base plate 4. A pressing member 10 of a cylindrical body, which pressurizes the base plate 4 by applying an end surface to the top of the base plate 4 is used to act pressurizing force upon the base plate 4. The pressing member 10 whose end surface is in a smaller form than that of the base plate 4 and quality of the material (for example, a transparent glass bar) allows the UV rays to transmit is used. A plurality of light sources 6 are arranged on the circumference of the pressing member 10 on the base plate 4, the UV rays 7 are applied to the base plate 10 in the direction of an arrow, which acts upon the UV curing resin material 3 and the same is cured.
申请公布号 JPH03126513(A) 申请公布日期 1991.05.29
申请号 JP19890264561 申请日期 1989.10.11
申请人 OMRON CORP 发明人 MAEDA TETSUO;TANIGAMI MASANOBU
分类号 B29C33/06;B29C33/38;B29C43/18;B29C43/36;B29L11/00 主分类号 B29C33/06
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