| 发明名称 |
Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same. |
| 摘要 |
<p>A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.</p> |
| 申请公布号 |
EP0428870(A2) |
申请公布日期 |
1991.05.29 |
| 申请号 |
EP19900119995 |
申请日期 |
1990.10.18 |
| 申请人 |
HITACHI, LTD. |
发明人 |
IMABAYASHI, SHINICHIRO;OKA, HITOSHI;TANAKA, ISAMU;KIKUCHI, HIROSHI;WATANABE, MAKIO |
| 分类号 |
G03F7/027;G03F7/004;G03F7/028;H05K3/00;H05K3/06;H05K3/18;H05K3/42;H05K3/46 |
主分类号 |
G03F7/027 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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