发明名称 FRAME ALIGNMENT DEVICE IN AUTOMATIC STICKING DEVICE FOR SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To prevent the generation of an error so as to do secure and favorable frame extrusion positioning by arranging the constitution such that plural pieces of frames loaded are extruded and positioned while being pressed in order from above so as to modify a warp. CONSTITUTION:At the time of push-up elevation, the weights of a weight arm 414, a movable arm 408, and various kinds of members appendant to them work on the uppermost frame F through a sucking head 412, and even if a warp occurs at the frame F, it is corrected to be level by this pressure from above. The level of the uppermost frame F, which has become level, becomes the specified alignment height. A pusher 502 is driven to advance in the condition that pressure is applied this way, and the uppermost frame F is sent out toward a frame positioning mechanism 600. And, by the notch for positioning of the frame F being engaged with a pin 604, the frame F is positioned. When the positioning of the frame F is completed, negative pressure is applied to the suction head 412.</p>
申请公布号 JPH03125454(A) 申请公布日期 1991.05.28
申请号 JP19890263530 申请日期 1989.10.09
申请人 NITTO DENKO CORP 发明人 OKAMOTO KENICHI;ITO HIDEO;MIYAMOTO SABURO
分类号 H01L21/67;B65H9/10;H01L21/68 主分类号 H01L21/67
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