| 摘要 |
<p>PURPOSE:To secure the flatness of an outer lead and to facilitate the mounting to a board by bonding a reinforcing material onto a film. CONSTITUTION:A lead 3 is made of copper or a film 2, and the part, projected into an opening 2a, of a lead 3 becomes an inner lead 3a, and the part projected from the margin of the film 2 becomes an outer lead 3b. After finish of bonding, a reinforcing member is bonded onto the film 2, and the undulation of the film 2, which has occurred during the hardening of a solder resist 4, is reformed. For this reinforcing member 8, a plate shaped one 0.1-0.2mm in thickness is used. What is more, if the reinforcing member 8 is made of metallic material (the surface is to be insulated beforehand), the heat radiating effect of a chip 5 can also be expected. Epoxy resin 7 is between the chip 5 and the reinforcing member 8, and the put chip 5 and the inner lead 3 are sealed and protected. The deformation of the film 2 at the time of epoxy resin 7 hardening is suppressed by the reinforcing member 8. The flatness of the outer lead 3b is secured, and the mounting to a board becomes easy.</p> |
