| 摘要 |
An auxiliary soldering device for electric solder iron includes a sleeve member fitted to a handle of the iron, a connecting seat disposed on the sleeve member, a first guide pipe located adjacent to a rear end of a connecting seat and a second guide pipe located adjacent to a front end thereof. The second guide pipe extends forward to the tip portion of the electric solder iron permitting a soldering wire to be fed through the guide pipes to the tip portion of the iron. A pressing plate engaging the soldering wire and a vane member are pivoted to the connecting seat with the vane member located above the pressing plate. The vane member has an elastic pushing plate downward extending to abut against the soldering wire, whereby pressing downward the front end of the vane member, the wire is advanced by the pushing plate through a certain distance for soldering use.
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