| 摘要 |
A backplane interconnection system for interconnecting an array of electronic components, such as integrated-circuit (IC) chip packages mounted on multilayer printed circuit boards. The backplane interconnection system includes an interface board and one or more interconnecting circuit board and a plurality of insulating boards arranged on a heat sink. The interconnecting circuit boards and the insulating boards are alternately interposed between the interface board and the array of electronic components such that an insulating board is positioned adjacent both the interface board and adjacent the array of electronic components. Connector elements disposed in selected openings of the insulating boards make electrical connections between contact areas on the interconnecting boards, the electronic components and the interface board. Any modification to an electronic component, such as a change in the input/output configuration of an IC chip package and its circuit board, can be readily accommodated by rearranging the connector elements in the insulating boards and/or replacing one or more of the interconnecting circuit boards.
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