| 摘要 |
PURPOSE:To prevent the thinning of lead width, wire breaking, short circuit, etc., by drawing a conductor pattern with photoresist on a conductive metallic foil by photolithography technology, and then making a through hole such as a mounting hole, etc., on the side of an organic insulating film, and then etching a conductive metallic foil so as to form a conductor pattern. CONSTITUTION:This has an organic insulating film 1 such as polyimide, polyester, etc., and a conductive metallic foil 2 (or circuit pattern consisting of conductive metal) such as copper, copper base alloy, etc. The top of the conductive metallic foil 2 is coated with varnish so as to form an organic insulating film, and a substrate is punched to bore a sprocket hole 10. Photoresist is applied on the conductive metallic foil 2 of the substrate, and then a circuit pattern 4 consisting of photoresist is drawn using photolithography technology. A through hole such as a mounting hole, etc., is made on the side of the organic insulating film by mechanically cutting the substrate or by another method. The conductive metallic foil of the substrate is etched to form a conductor pattern. |
