Die attachment method using nonconductive adhesive for use in high density interconnected assemblies

摘要

A method for grounding or electrically biasing an integrated circuit chip without using a conductive die attach material comprises affixing the chips to a substrate using a thermoplastic polyimide adhesive. A metallization layer electrically connects the sides of the chips, which act as grounding surfaces, to a biased or grounded conductive layer on the substrate. The top surfaces of the integrated circuit chips which include the interconnection pads are protected against undesired metallization by a removable protective layer while the metallization layer is applied. Metal electroplated on the metallization layer serves the functions of a heat sink for the chip and a ground plane between chips.