| 摘要 |
PURPOSE: To improve the cooling efficiency of a laminated array using a simple mechanism by a method, wherein holes with which a refrigerant is forcedly passed in the vertical direction, are formed in high density on the outside part of a plurality of circuit substrate packed ion the vertical direction. CONSTITUTION: A plurality or holes 70, through which air is sent to an outside part 60, of a main substrate 15, are formed on a circuit pack 10 which is used as a cooling region 55. The heat generated on an integrated circuit 50 is transferred to the main substrate 15 through an auxiliary substrate 45 and then transferred to a part 60 from the region adjacent to a multiple chip module 40. The heat is transferred to the air which passes through the holes 70 by a fan 80 and absorbed to the region 60. On the region 60, turbulence of air stream is generated by the mixture of a hot part and a cool part, and thermal contacts increased between a refrigerant and the part adjacent to the holes on the main surface. As a result, a circuit substrate can be cooled in a highly efficient manner by a simple structure.
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