| 摘要 |
<p>PURPOSE: To form a soldered film in the thickness same as a device by a method, wherein the device is placed on a printed board using a suction pipette, the pipette is pressed by applying a limited force, and the force added to an arcuate electrode is reduced. CONSTITUTION: A device BE is placed on the mounting position of a printed board LP using a suction pipette S. At least an arcuate electrode B1 is brought down to a lead pin A, and the lead pin A is pressed to a connection pad AP. Then, the arcuate electrode B1 is resistance-heated, and solder is fused. The arcuate electrode B1 is brought down continuously, and the lead pin A is pushed into the fused solder. The force added to the arcuate electrode is reduced, and/or the arcuate electrode is returned to the original state. As a result, a solder film of uniform thickness can be formed between the lead pin and a conductive path or by connection pad, and the quality of the soldered part can be improved.</p> |
