首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
LEAD FRAME
摘要
申请公布号
JPH03124054(A)
申请公布日期
1991.05.27
申请号
JP19890262366
申请日期
1989.10.06
申请人
MITSUBISHI ELECTRIC CORP
发明人
UEDA TETSUYA
分类号
H01L23/50
主分类号
H01L23/50
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Synthesis of epothilones, intermediates thereto, analogues and uses thereof
Non-contact temperature sensor with temperature compensating heat sensitive elements on plastic film
Semiconductor integrated circuit and recording medium
Non-invasive cardiorespiratory monitor with synchronized bioimpedance sensing
Image shake detecting device
System and methods for the reduction and elimination of image artifacts in the calibration of x-ray imagers
Way to compensate the effect of coupling between bitlines in a multi-port memories
Printed circuit board retaining device for monitors
Yoke-type head with magneto-resistance effect film recessed from medium facing surface and extending across magnetic gap
Exposure apparatus and method, device manufacturing method, and discharge lamp
Antenna having multi-directional spiral element
Semiconductor materials with partially filled skutterudite crystal lattice structures optimized for selected thermoelectric properties and methods of preparation
Nitric oxide synthase inhibitors
Semiconductor method of manufacture
Organic anti-reflective coating material and its preparation
Use of mesomorphic phases in food products
Tableted product prepared by vacuum freeze-drying of a plant belonging to genus aloe of family Liliaceae and the method for producing same
Clamp assembly and method of use
Mandibular advancer and method of installing the same
Semiconductor manufacturing method and semiconductor manufacturing apparatus
