| 摘要 |
PURPOSE:To prevent a solder and a pad from forming an alloy and to make possible the strict control of a solder feed rate by a method wherein the solder is fed at the time of the soldering work of a material to be bonded and the solder feed rate is made to correspond to a change in the capacity of the cavity of a pump device. CONSTITUTION:A piston member 70 and a heated chip 2 are made to simultaneously descend with a frame 32 and the chip 2 is made to abut on a pad 10 on a printed board 1. After this, a load is further applied downward, a heating head 4, a holding member 21, a moving wall member 71 and a solder pot 90 are slided to a case of the head 4, a case 40 coupled with the frame 32 and the member 70 only are made to descend, the head 4 is left at its position and a deflection to correspond to the amount of the displacement of the position is generated in a buffer spring 5. The volume of a cavity 7 is reduced and a solder of an amount to correspond to a difference between the reduced volume and the initial volume of the cavity is made to discharge through a solder extraction hole 20 of the chip 2 via a solder inflow path 73.
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