| 摘要 |
PURPOSE:To minimize stress at the time of temperature rise, and to mount a large-sized chip by forming the chip fixing section of the lead frame by combining a section, which is easily deformed, with a bent section deformable more than the loaded chip and a plurality of supporting members. CONSTITUTION:The fixing section 2, which is supported by frame bodies 3 and to which the chip 1 is mounted, is punched and prepared in a shape that the end sections of the adjacent two sides of approximately square supporting plate sections 6-9 are combined by the beltlike sections 10-13, which are easily deformed. At least one bent section is formed previously to the section, which is easily deformed, and the angle of bending is changed when thermal stress applies and the section is deformed. Accordingly, since punched sections (clearances) and the bent sections relaxing stress are formed, the generation of a crack, etc. in the chip 1 can be prevented, and the lead frame which can load and fix the large-sized chip can be manufactured. |
