Thermal dissipation device for printed circuit cards and method for manufacturing it

摘要

The device makes it possible to dissipate the thermal power from electronic components carried on a card. It comprises a metal plate (18) constituting a thermal drain, placed parallel to the card (10) in thermal liaison with the components (12), and of which at least one edge is linked to a cold wall by a thermal connector. The plate (18) is thermally linked to the components by an interposed layer (20) of moulded material, which is thermally conductive and electrically insulating, one large face of which is in contact with the plate and the other large face of which has a shape such that it fits round the components. <IMAGE>