| 摘要 |
PURPOSE:To prevent a film from curing and to improve it in reliability as to dimensional stability, adhesive force, and the like by a method wherein polymide resin layers different from each other in thermal linear expansion coefficient are applied onto a conductor making the resin layer of higher thermal expansion coefficient face outward, which is dried up to be set in a pressure reduced and/or a reducing atmosphere to form a multilayered insulator. CONSTITUTION:A copper plated laminated board is manufactured in such a method that at least two types of polyimide resin compositions or their precursor compositions different from each other in thermal linear expansion coefficient are applied onto a conductor making a resin layer of higher thermal expansion coefficient located outside, which is dried up to be set in a pressure reduced and/or a reducing atmosphere. It is preferable that the linear expansion coefficient difference between the high thermal linear expansion resin layer and the low thermal linear expansion resin layer is larger than 510(1/K) or above. It is also preferable that a resin applying method is carried out in such a manner that two more kinds of polyimide resin or their precursor solutions are applied onto a conductor at the same time using a multilayered die. By this setup, even if a heat hysteresis is given to a copper plated laminated board of this design, it is free from curling, torsion, warpage, and the like, can be secured enough in adhesion, flexibility, dimensional stability, and the like, and can be made small in curling after the etching of a conductor so as to be improved in workability. |
