发明名称 Method for hollowing out grooves in a semiconductor
摘要 Grooves are hollowed out at the surface of a semiconductor by means of an etching operation performed in an electrolyte bath 2, those portions of the semiconductor 1 which correspond to the grooves being illuminated by the collimated light 3, the rays of which are virtually perpendicular to the surface of the semiconductor. According to the invention, the material 1 is electrically biased (4, 5, 6, 7) so as to be photoelectrolytically etched. In the case in which the semiconductor 1 is made of gallium arsenide, the electrolyte 2 is advantageously hydrochloric acid, HCl, or hydrobromic acid, HBr. This electrolyte preferably contains an oxidising-agent/solvent, especially a hypochlorite and/or a chlorine solution. Application: etching of cut-out tracks in semiconductor wafers. <IMAGE>
申请公布号 FR2654869(A1) 申请公布日期 1991.05.24
申请号 FR19890015111 申请日期 1989.11.17
申请人 RADIOTECHNIQUE COMPELEC 发明人 SANDINO JEAN-PAUL;CLECHET PAUL;MARTIN JEAN-RENE;ACHARD MICHEL
分类号 H01L21/3063;H01L21/308 主分类号 H01L21/3063
代理机构 代理人
主权项
地址