| 摘要 |
<p>PURPOSE:To efficiently manufacture the title module for IC card in high reliabil ity capable of easy mounting on an IC card substrate in high practical reliability such as intensive bending strength by a method wherein the module is provided with a peripheral part formed into one body with a molding resin so as to be protruded from the sides of the module. CONSTITUTION:The title module 1A is provided with a substrate 3 with a connecting terminal 17 mounted on one surface, a previously resin-sealed semicon ductor integrated circuit 14 held by the other surface of the substrate 3 and electrically connected to the connecting terminal 17, a molding resin 21 to form the substrate 3 and said integrated circuit 14 into one body so as to avoid the exposure of an electrically connecting part of at least the connecting termi nal 17 and the said integrated circuit 14 as well as a peripheral part 22 formed into one body with the molding resin 21 so as to be protruded from the sides of the module 1A. Through these procedures, when this module 1A is mounted on a card substrate, any imposed stress can be dispersed by the peripheral part 22 so that the endurance of the IC card to any external force such as bending may be enhanced.</p> |
