| 摘要 |
PURPOSE:To restrict any stray inductance to a low level thereby enabling the whole impedance to be controlled as well as any noise to be abated by a method wherein an insulating layer is formed on the surface and the rear of an inner lead part, and a better pattern for impedance adjustment is formed almost on the whole surface of the insulating layer and so forth. CONSTITUTION:An insulating layer 13 is formed on the surface and the rear of the inner lead part 12 of a lead frame 11 whereon a semiconductor element 20 is mounted and then a better pattern 14 for impedance adjustment is formed almost on the whole surface of the insulating layer 13 so as to make the inner lead part 2 a strip line while the better pattern 14 and the lead frame 14 are electrically connected through the intermediary of a through hole 15 formed through the insulating layer 13. Next, for example, the ECL element 20 is diebonded onto an island part 16 of the lead frame 11 of a semiconductor mounting substrate 10 as so far mentioned; contact elements of ECL element 20 and the inner lead part 12 are wire-bonded to each other; and then an outer lead parts 17 are removed so that the whole body may be transfer-molded to manufacture a semiconductor mounting device 1. |
