| 摘要 |
<p>PURPOSE:To realize satisfactory solderability, mechanical strength and to high reliability solder bonding by forming a recess of a structure integrated with the upper surface of a viahole so formed as to be previously connected to an inner circuit as a buried through hole in the center of the surface of a surface mounting pad. CONSTITUTION:A multilayer printed circuit board 22 is composed of a surface mounting pad 18 having a recess 16, a surface circuit 17, an inner circuit 19, a power source.ground layer 20, a through hole 16 and an insulator 21, and a component terminal 31 of a surface mounting component 30 is inserted into the recess 16 of the pad 18. The pad 18 and the recess 16 are formed in a circular shape. Copper-plating layers 14 are provided on the bottom, side of the recess 16 and the upper surface of the pad, composed of a copper foil 1 and a copper-plating layer 4, and formed on a viahole 23.</p> |
