| 摘要 |
PURPOSE:To reduce positional deviation due to the movement of a metal stage and to enable inspection of any type of D surface mounting type integrated circuit package by the one device by installing a distance measuring unit under the stage and measuring the distance from the upper surface of the stage at the end of the lead of a package placed on the stage through a slit. CONSTITUTION:A flat plate 4 is placed on a metal stage 2b, and distances (B1, B2,..., Bn) from a distance measuring unit 3 installed under the stage to leads (P1, P2,..., Pn) to the surface of the stage 2b are obtained through slits (SL1, SL2,..., SLn) while moving the stage in a direction DIR. Then, a flat package 2b is placed on the stage 2b, and distances (L1, L2,..., Ln) from the unit 3 to the lower surface at the end of each lead (P1, P2,..., Pn) is obtained while moving the stage in the direction DIR. From the result, the flatness (C1, C2,..., Cn) of each lead is obtained as C1=L1-B1, C2=L2-B2,..., Cn=Ln-Bn. |
