| 发明名称 |
Method for the reduction of pinholes in resist films. |
| 摘要 |
<p>A process for applying a pinhole free organic coating on a conductive substrate during an electrodeposition process. The elimination of pinhole defects is accomplished by use of a vibrating device interfaced with the equipment which dislodges gas bubbles adhering to the surface of the substrate during the electrodeposition process.</p> |
| 申请公布号 |
EP0427923(A2) |
申请公布日期 |
1991.05.22 |
| 申请号 |
EP19900115155 |
申请日期 |
1990.08.07 |
| 申请人 |
SHIPLEY COMPANY INC. |
发明人 |
HO, IVAN;HARRIS, MARTIN J.;HARRISON, RICHARD;MILLER, PHILLIP J. JR |
| 分类号 |
C23F1/00;C25D13/22;G03F7/16;H01L21/027;H05K3/00;H05K3/06;H05K3/18 |
主分类号 |
C23F1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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