| 摘要 |
PURPOSE:To enhance density and to reduce in size a wiring circuit board, etc,. by mounting semiconductor devices on both side surfaces of a film board, connecting electrodes to lead patterns formed on both side surfaces of the board, and connecting them via through holes. CONSTITUTION:A semiconductor device package P is formed with lead patterns 20, 23 on both side surfaces of a film board 10, and semiconductor devices 30 are placed and connected at the centers of the patterns 20, 23 through bumps 70. The pattern 20 of the upper surface side is connected partly to a land 22 formed at the opposite side surface via a through hole 21 bored through the board 10 near the outer peripheral end. The remaining pattern 20 is connected to the pattern 23 of the opposite side surface via a similar through hole 21. The devices 30, 30 of both side surfaces of the board 10 and the central parts of the patterns 20, 23 are integrally sealed with sealing resin 50, and the hole 21 is also covered. |
